Search
Menu
Photonics SuppliersTest & Measurement
Full company details
Bruker Nano Surfaces
Div. of Bruker Corp.
Map5255 E Williams Circle, Suite 2080
Tucson, AZ 85711
United States
Phone: +1 520-741-1044
Fax: +1 520-294-1799
Toll-free: +1 800-873-9750

Full-Field Hotspot Detection and High-Resolution Topographic Characterization of Post-CMP Wafers with 3D Optical Profiling

Author: Roger Posusta and Samuel Lesko Sunday, August 1, 2021
Traditional methods of post-CMP process evaluation have analytical limitations that, in light of tightening process control limits, do not meet the growing need for more accurate wafer surface characterization in semiconductor chip manufacturing. This application note describes how white light interferometry (WLI) enables advanced packaging manufacturers and CMP specialists to obtain critical data from the high-resolution, full-die maps this 3D optical profiling technique makes possible.

More white papers
Download White Paper
File: Full_Field_Hotspot_Detection.pdf (1.07 MB)
To download this white paper, please complete the *required fields before clicking the "Download" button.
Your contact information
* First Name:
* Last Name:
* Email Address:
* Company:
Address:
Address 2:
City:
State/Province:
Postal Code:
* Country:
Phone #:
Fax #:

Register or login to auto-populate this form:
Login Register
* Required

When you click "Send Request", we will record and send your personal contact information to Bruker Nano Surfaces by email so they may respond directly. You also agree that Photonics Media may contact you with information related to this inquiry, and that you have read and accept our Privacy Policy and Terms and Conditions of Use.
We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.