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The International Microelectronics And Packaging Society (IMAPS) has announced that it will sponsor a new symposium -- ICAPS 2002, The International Conference on Advanced Packaging and Systems, scheduled to debut at the Reno Hilton Hotel, Reno, Nevada, March 10-13, 2002. IMAPS is seeking previously unpublished papers on recent works on appropriate topics. Abstracts of 250-300 word length should be submitted electronically by September 14, 2001, using the online submittal form at: www.imaps.org/abstracts.htm. For questions send email to [email protected]. Kamelian, a fiber optic components...Read full article

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    Published: August 2001
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