Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
SPECIAL ANNOUNCEMENT
2016 Photonics Buyers' Guide Clearance! – Use Coupon Code FC16 to save 60%!
share
Email Facebook Twitter Google+ LinkedIn Comments

Coherent Uses Diode Lasers for Gold Soldering

Photonics.com
Feb 2002

SANTA CLARA, Calif., Feb. 1 -- Coherent Inc's. Laser Processing Center has developed a new method for employing high-power diode lasers to solder gold-metallized telecommunications fibers to gold-plated substrates.

To overcome typical complications of soldering gold-plated objects, the Laser Processing Center is using a high-power 40-watt NIR fiber array package (FAP) system equipped with a standard 1:1 optics imaging accessory, said Tony Hoult, applications manager. To initially prove the feasibility of diode lasers for gold-tin soldering, Hoult said he placed a number of gold-plated telecom fibers on a piece of gold-plated stainless steel with a 25-mm thick gold-tin preform and applied an 800-mm-diameter spot from the FAP system. By strictly controlling the beam's timing, positioning and pulse, Hoult said he produced defect-free joints with no associated damage to the fiber.

Hoult contrasts Coherent's FAP system soldering scheme with the solid-state laser-based welding systems that are currently being used for this fiber attachment application.



Comments
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2016 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.