MUNICH, Germany, March 7 -- SUSS MicroTec Test Systems GmbH has signed a cooperation agreement with Fraunhofer Institute for Reliability and Microintegration (IZM) to define and evaluate technologies for failure analysis and wafer testing. The partnership will establish a
submicron probing demonstration center at the IZM facility in Munich. The demonstration center will include a complete failure analysis station, including laser cutting and CAD navigation as well as low signal probing in the SUSS ProbeShield environment. Testing will be undertaken on wafers up to 300 mm as well as on bonded dies and in a wide temperature range between -55 degrees C and 300 degrees C. Part of the system will be a system for probing structures below 0.2 microns.