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Communications Companies Join Forces To Develop 10-Gigabit Module

Photonics.com
Mar 2002
COSTA MESA, Calif., March 8 -- Ten leading communications companies have formed a common specification for multisourcing application-agnostic, ultrasmall form factor, 10 Gb/s modules, or XFP modules. They are: Broadcom Corp., Brocade, Emulex Corp., Finisar, JDS Uniphase, Maxim Integrated Products, ONI Systems, ICS (a Sumitomo Electric company), Tyco Electronics and Velio.

XFP Modules feature a serial 10 Gb/s electrical interface called XFI. This interface technology removes the complexity and power associated with placing electrical transceivers inside today's modules, resulting in significant space, power and cost savings to module manufacturers, according to the group. XFI technology is powered by pserial 10 Gb/s devices developed by Broadcom.



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