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StratEdge to Provide Packaging and Assembly for Rockwell Scientific

Photonics.com
Apr 2002
SAN DIEGO, April 29 -- Rockwell Scientific Co. has selected StratEdge, producer of semiconductor packages for high-speed wireless devices, to provide the packages and assembly services for its high-performance dual track-and-hold chip for ultrawideband data acquisition. Rockwell Scientific, located in Thousand Oaks and Camarillo, Calif., develops high-speed, mixed-signal circuits for commercial and defense applications.

Rockwell Scientific's package is based on StratEdge's leaded, low-cost commercial (LCC) family of DC-to-23 GHz amplifier packages. The ceramic microwave package features four RF leads and multiple DC leads for attachment to the next level of the system without sacrificing electrical performance critical to microwave technology, StratEdge said.



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