The Advanced Packaging and Interconnect Alliance (APiA), a global group of leading semiconductor equipment and process suppliers, has seven new members representing equipment, materials and process-technology organizations. They are: Albany Nanotech at the University of Albany (material and process integration at 300 mm wafer R&D fab), Dynaloy (specialty chemicals for the removal of photoresist films and solder flux), EKC Technology Inc. (high-performance chemicals for photoresist removal and surface preparation), Excelerate Technologies (data connectivity and analysis software), HD Microsystems (polymer coatings), Heller Industries (reflow ovens), and Sikama International (conduction/convection reflow ovens and wafer flux coaters).