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Corning IntelliSense, Northrop Grumman Collaborate on RF MEMS
Feb 2003
WILMINGTON, Mass., Feb. 6 -- Corning IntelliSense Corp. is participating with Northrop Grumman on an "RF MEMS improvement program" sponsored by the Air Force Research Laboratory/Defense Advanced Research Projects Agency (AFRL/DARPA). The program will focus on designing, modeling and fabricating low-cost radio frequency microelectromechanical system (RF MEMS) devices for Department of Defense (DoD) applications.

Jonathan Bernstein, vice president of technology at Corning IntelliSense, said, "This is a great opportunity for us to combine our expertise in MEMS with that of Northrop Grumman. We look forward to pushing the state of the art and assisting the advancement of ultrareliable RF MEMS for both DoD and wireless communications."

RF MEMS leverage the mechanical and electrical attributes of MEMS technology to address shortcomings of traditional semiconductor devices. For many wireless applications, RF MEMS offer smaller, lower power, and higher performing communication products, the companies said.

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