Close

Search

Search Menu
Photonics Media Photonics Buyers' Guide Photonics EDU Photonics Spectra BioPhotonics EuroPhotonics Industrial Photonics Photonics Showcase Photonics ProdSpec Photonics Handbook
More News
SPECIAL ANNOUNCEMENT
2016 Photonics Buyers' Guide Clearance! – Use Coupon Code FC16 to save 60%!
share
Email Facebook Twitter Google+ LinkedIn Comments

DRS Awarded Infrared System Contract

Photonics.com
Feb 2003
PARSIPPANY, N.J., Feb. 19 -- DRS Technologies Inc. announced today it has received a contract to design and develop state-of-the-art active and passive infrared sensing systems for the vertical integrated sensor arrays (VISA) program of the Defense Advanced Research Projects Agency (DARPA), Microsystems Technology Office, for future advanced military and space surveillance applications.

The program will focus on massively parallel signal processing in focal plane array (FPA) technology, considered necessary to address future strategic and tactical system needs of multifunction active and passive thermal imaging and laser jamming avoidance not addressed with current FPA technology, DRS said.

The contract, valued at $10.5 million including options, was awarded to DRS by the Navy's Space and Naval Warfare Systems Center (SSC) San Diego in San Diego, Calif. For the initial $4 million award, the company's DRS Infrared Technologies unit in Dallas, Texas, will lead the effort to develop processes and circuit concepts and demonstrate prototype infrared VISA FPAs for Department of Defense military applications. The company's DRS Sensors & Targeting Systems in Anaheim, Calif., will also contribute to the effort. The initial award has a duration of 18 months.

For this award, DRS Infrared Technologies will develop techniques to stack and interconnect multiple silicon wafers to form massively parallel electrical connections between wafer layers, based on the company's high-density vertically integrated photodiode infrared detector technology. DRS Sensors & Targeting Systems will design and develop a process to cut high-aspect ratio holes in silicon wafers containing FPA read-out integrated circuits (ROIC) and electrically interconnect multiple ROIC layers using thin-film metalization techniques.

For more information, visit: www.drs.com



Comments
Terms & Conditions Privacy Policy About Us Contact Us
back to top

Facebook Twitter Instagram LinkedIn YouTube RSS
©2016 Photonics Media
x We deliver – right to your inbox. Subscribe FREE to our newsletters.