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Triformix Funding Round Nets $5.2 M

Photonics.com
Dec 2003
SANTA ROSA, Calif., Dec. 1 -- Triformix Inc., a precision-molded optical components company specializing in optical semiconductor packaging, announced it has closed a second round of funding totaling $5.2 million.

Triformix received $4.6 million in its first round of funding in June 2001 from XR Ventures, SBV Venture Partners and Cypress Semiconductor. The most recent round adds $5.2 million to the company's total. With additional funds from private sources, the overall investment in Triformix is $10.4 million in less than three years. A new investor, American River Ventures, led the new round with participation by Pacifica Fund, Selby Venture Partners and SBV Venture Partners.

Triformix said the investment will enable it to accelerate business development, expand its manufacturing facilities and penetrate new markets. The company said it is aggressively expanding its management team, with executive positions open in finance, sales and marketing.

Harry Laswell, general partner of American River Ventures, has been appointed to the company's board of directors, along with Himanshu Choksi of Pacifica Fund and Bob Marshall of Selby Venture Partners. Jacques Vallee of SBV Venture Partners will continue to serve on the board.

Triformix makes optical components and semiconductor packaging for high-volume products using proprietary injection molding capabilities. Applications include fiber optic connectors, cellular phone cameras, optical sensors for computer peripherals, medical instrumentation and LED illumination.

For more information, visit: www.triformix.com



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