Search
Menu
Hamamatsu Corp. - Earth Innovations LB 2/24

3-D Imaging Chip Has Broad Potential

Facebook X LinkedIn Email
SCHAUMBURG, Ill., Dec. 9 -- A collaborative effort among Motorola's Semiconductor Products Sector, the Massachusetts Institute of Technology's (MIT) Media Lab's Center for Bits and Atoms and Elesys North America has resulted in the development of an electric-field imaging chip from Motorola that enables contactless sensing and imaging of low-level electric fields for a variety of systems and products, from automobile airbag controllers to wheelchairs. Motorola said the uses for electric-field imaging are vast, but until recently they have been restricted by the difficulty in implementing...Read full article

Related content from Photonics Media



    Articles


    Products


    Photonics Handbook Articles


    White Papers


    Webinars


    Photonics Dictionary Terms


    Media


    Photonics Buyers' Guide Categories


    Companies
    Published: December 2003
    Glossary
    chip
    1. A localized fracture at the end of a cleaved optical fiber or on a glass surface. 2. An integrated circuit.
    Automobile SafetychipE-Fieldelectric fieldElesysImagingMITMotorolaNews & Featuressemiconductors

    We use cookies to improve user experience and analyze our website traffic as stated in our Privacy Policy. By using this website, you agree to the use of cookies unless you have disabled them.