SAN DIEGO, Feb. 10 -- JMAR Technologies Inc. organized a presentation on the global status of x-ray lithography (XRL) at a two-day meeting sponsored by International Sematech last month in Los Angeles.
The XRL forum participants included Canon, NTT-AT, Mitsubishi, Sumitomo and Philtech, and US-based companies Rohm and Hass Electronic Materials (formerly Shipley), TOK/OHKA America, BAE Systems, the Massachusetts Institute of Technology Nanostructures Laboratory, the University of Wisconsin Center for Nanotechnology, the Louisiana State University Center for Advanced Microstructures and Devices and Grenon Consulting.
"Although many observers were surprised by the progress made by x-ray lithography (XRL) over the past few years, the mainstream silicon industry will continue to incrementally extend optical technology as long as possible," said Ronald A. Walrod, JMAR's CEO. "The current belief is that 193 immersion will meet industry needs to the 45-nm node and that EUV will be introduced at the 32-nm node in 2009."
Participants noted several significant achievements in XRL technology:
"With contracts to continue refinement of our collimated plasma lithography x-ray source and to produce test masks, JMAR is preparing for opportunities in the gallium arsenide chip market and in silicon wafer lithography market niches," Walrod said. "Our systems division will continue to market its steppers for special lithographic applications."
- Gallium arsenide (GaAs) communication chips are being produced using XRL;
- Prototype masks have been made to produce 65-nm and 30-nm features;
- 300-mm reference wafers using XRL are being supplied to a number of companies for etch and deposition process development at the 90-nm node and below;
- Beta Source and stepper systems have been developed for both synchrotron and point source configurations;
- University and industry development efforts have identified paths to meet production requirements all the way to the 25-nm node; and
- XRL is a "next-generation lithography" candidate that has actually produced wafers.
He said JMAR will also work to commercialize its technology in other markets, including homeland security, nanotechnology and biotechnology.
"Our recent $8 million financing facilitates our efforts to accelerate company growth in new markets through product development and constructive alliances," Walrod said.
JMAR Technologies, based in San Diego, develops highly specialized systems that employ x-ray lithography (which JMAR calls collimated plasma lithography, or CPL), to make semiconductors, and makes related products such as laser light sources, primarily for the US government.
For more information, visit: www.jmar.com