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Agilent, Link to Develop Dongle Line

Photonics.com
Aug 2004
PALO ALTO, Calif. & TOKYO, Aug. 11 -- Agilent Technologies Inc. and Link Evolution Corp., a Tokyo-based wireless communications software development company, announced today they will collaborate on the development of an IrFM-compliant (infrared financial messaging) smart dongle product for the Japanese infrared (IR) mobile-payment market.

Agilent said IrFM smart dongle serial adapters can easily be attached to millions of point-of-sale devices to provide instant IR connectivity for secure wireless payments. The collaboration will combine Agilent's expertise in IR hardware development and manufacturing with Link Evolution's software development capability. The companies plan to introduce IrFM products in Japan later this year, then will expand to other markets.

"As the leader in infrared connectivity solutions, we recognize the opportunity for growth in IrFM applications worldwide, particularly in Japan, where many unique services are offered," said Kee Hane Ngoh, vice president and general manager of Agilent's Infrared Product Division.

"We expect this joint effort to quickly provide a solution to the complicated Japanese IR financial payment system," said Gontaro Kitazumi, CTO and executive vice president of research and development at Link Evolution, which was a pioneer of IrFM software in Japan. Earlier this year, Agilent introduced its HSDL-D100 smart-dongle line, a hardware and software platform that supports customizable IrDA applications including point-and-pay IrFM financial payment services, picture and music file transfers between mobile devices and kiosk data distribution to mobile devices.

For more information, visit: www.agilent.com



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