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Aug 2004
Color Kinetics Inc., a Boston maker of digital lighting systems and technologies, said it has been issued a patent relating to a "miniaturized, integrated, intelligent solid-state string light in which individual LED nodes in a string configuration have the capability to be independently controlled." US patent number 6,777,891 relates in part to technology that is implemented in Chromasic, the company's proprietary integrated circuit. One commercial application of this technology is its iColor Flex SL product, a string light comprised of individually controllable tri-color LED nodes.    . . .    Indium Corp. of America, a supplier of electronics assembly materials, held its annual summit for its worldwide technical support team recently at the company's Clinton, N.Y., headquarters. Presentations were made on developments in equipment, processes, materials science, tin-lead (SnPb) technology, pericom lead (Pb)-free technology, electronic packaging technology and new products. Indium has factories in North America, Europe and Asia.    . . .    Molecular Imprints Inc., (MII), an Austin, Texas, manufacturer of step-and-flash imprint lithography equipment used to imprint circuit designs onto semiconductor wafers, announced that Tokyo Electron Ltd., a supplier of semiconductor and flat panel display production equipment, will contribute to its series-B funding round. MII's investors also include KLA-Tencor, Carl Zeiss SMT and Motorola. The company, which sells nanolithography systems to markets including semiconductor devices, displays, photonics structures and data storage, said it is developing innovations in semiconductors and nanotechnology.

Metal used in components of the crystalline semiconductor alloys indium gallium arsenide (InGaAs), indium gallium arsenide phosphide (InGaAsP), and the binary semiconductor indium phosphide (InP). The first two are lattice-matched to InP as the light-emitting medium for lasers or light-emitting diodes in the 1.06- to 1.7-µm range, and the last are used as a substrate and cladding layer.
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