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Company Wins Contract for Bonding Cluster

Photonics Spectra
Oct 2004
EV Group, a supplier of wafer-bonding and lithography equipment based in Schrading, Austria, has received an order for an automated and fully integrated temporary bonding cluster from a US manufacturer of high-brightness LEDs. The system enables processing of wafers below 100 µm, which is an important factor in fabricating devices for high-intensity LEDs in mobile appliances, and other compound semiconductors, such as power and high-frequency devices.


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