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Tessera and NDSU Partner for Chip Manufacturing, Research

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SAN JOSE, Calif., Aug. 19 -- Tessera Technologies Inc., a provider of miniaturization technologies for the electronics industry, announced that it has completed a successful chip-scale packaging (CSP) technology transfer to North Dakota State University (NDSU) and has partnered with NDSU in the development of a microelectronics center at the university. The company says the announcement marks the culmination of a joint effort by Tessera and NDSU to create a regional microelectronics center supporting the manufacturing needs of government agencies while facilitating the growth of technology...Read full article

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    Published: August 2005
    chip-scaledefenseDMEADoDindustrialNDSUNews & FeaturessemiconductorsSensors & DetectorsTessera

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