Schott AG of Mainz, Germany, has opened a facility in Singapore for the encapsulation of electronic components. An addition to the company's electronic packaging business unit, Schott Advanced Packaging Singapore Pte. Ltd. uses a wafer-level packaging production process to seal chips with glass. The technique eliminates the need for bonding wires and additional housings, enabling further miniaturization of the components. The process, which implements plasma etching technology, takes place in a cleanroom environment and has applications in packaging image sensor chips for cameras in mobile phones.