SANTA CLARA, Calif., Sept. 30 -- Brion Technologies, a Santa Clara-based developer of products for lithography-driven integrated circuit design and manufacturing, has announced a joint development agreement with the Crolles2 Alliance, which focuses on CMOS technologies for semiconductor research and development, including design platform and packaging. The alliance is part of a five-year agreement (through to December 2007) among STMicroelectronics, Philips Semiconductors and Freescale Semiconductor (formerly Motorola's Semiconductor Products Sector). It was created in April 2002 when Motorola joined an existing alliance between Philips and STMicroelectronics. Taiwan Semiconductor Manufacturing Company Ltd. also participates, for process development and alignment. The Crolles2 joint R&D and pilot manufacturing facility, near Grenoble, France, is currently running 90 nm in production and 65 nm for prototyping and is developing CMOS processes at the 45-nm and, ultimately, 32-nm node. Brion said it has delivered (RET/OPC) (resolution enhancement technology/optical proximity correction) process window-enabled applications that run on its hardware-accelerated Tachyon platform. The Crolles2 Alliance partners and Brion intend to further test and develop these applications for chip designs. The three companies have also entered into licenses for Brion’s Tachyon RDI product. The system was recently installed in the Crolles2 facility and is expected to be deployed in a production environment for 90-nm and 65-nm. For more information, visit: www.brion.com