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  • Indium Hires Semiconductor Packaging Materials Manager
Nov 2006
andymackie.jpgIndium Corp., a Clinton, N.Y., supplier of electronics assembly materials, announced it has hired Andy Mackie, PhD, as product manager for its semiconductor packaging materials division. He will be responsible for global marketing of products including solder spheres, ball attach fluxes, wafer bumping fluxes and pastes, and epoxy fluxes. Mackie, who has more than 17 years of experience in new product development, sales and marketing of electronics assembly and semiconductor packaging, is an industry expert in solder paste printing, reflow and atmosphere control in electronics assembly. He received the IPC (Association Connecting Electronics Industries) President’s Award in 2001 for his leadership in its solder paste task force and assembly and joining materials subcommittee.

Metal used in components of the crystalline semiconductor alloys indium gallium arsenide (InGaAs), indium gallium arsenide phosphide (InGaAsP), and the binary semiconductor indium phosphide (InP). The first two are lattice-matched to InP as the light-emitting medium for lasers or light-emitting diodes in the 1.06- to 1.7-µm range, and the last are used as a substrate and cladding layer.
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
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