Indium Hires Semiconductor Packaging Materials Manager
Indium Corp., a Clinton, N.Y., supplier of electronics assembly materials, announced it has hired Andy Mackie, PhD, as product manager for its semiconductor packaging materials division. He will be responsible for global marketing of products including solder spheres, ball attach fluxes, wafer bumping fluxes and pastes, and epoxy fluxes. Mackie, who has more than 17 years of experience in new product development, sales and marketing of electronics assembly and semiconductor packaging, is an industry expert in solder paste printing, reflow and atmosphere control in electronics assembly. He received the IPC (Association Connecting Electronics Industries) President’s Award in 2001 for his leadership in its solder paste task force and assembly and joining materials subcommittee.