Berliner Glas KGaA
announces structured glass wafers for interposer and encapsulating microparts in MEMS and MOEMS for industrial applications. The wafers are composed of borosilicate glass and are available in sizes up to 8 in. They offer alignment marks; bonding readiness; optically clear surfaces; thermal coefficiency of expansion adapted to the wafer; tight form and position tolerances; freedom for designing the cavities, even with nonuniform depths; plano and parallel surfaces with minimal roughness; and integration of defined open areas of optical windows for use with MOEMS and of metallic vias for increasing packing density.
To contact the manufacturer of this product, click here