CHANDLER, Ariz., Oct. 26, 2007 -- Production of a new generation of microprocessors for PCs, laptops, servers and other computing devices began this week inside Intel Corp.'s first high-volume 45-nm manufacturing factory.
Called "Fab 32," the $3 billion factory, in Chandler, Ariz., will use Intel's 45-nm process technology, based on what it calls its breakthrough in "reinventing" certain areas of the transistors inside processors to reduce energy leakage. The 45-nm transistors use a Hafnium-based high-k material for the gate dielectric and metal materials for the gate, and they are so small that more than 2 million can fit on the period at the end of this sentence. Millions of these tiny transistors will make up Intel's faster, more energy efficient lead- and halogen-free processors for PCs, laptops and servers, as well as ultralow-power processors for mobile Internet and consumer electronic devices and low-cost PCs. The first of the company's 45-nm processors is scheduled to be introduced on Nov. 12.
Fab 32 is Intel's sixth 300-mm wafer factory and its second factory to produce 45-nm chips. Intel first produced 45-nm processors in its Oregon development facility, called D1D, in January and is now moving into high-volume production with the opening of Fab 32. Two additional 45- and 300-mm manufacturing factories are scheduled to open next year in Kiryat Gat, Israel (Fab 28) and Rio Rancho, N.M. (Fab 11x). "Using 300-mm wafers lowers the production cost per chip while diminishing overall use of resources," Intel said in a statement.
With 184,000 square feet of cleanroom space, the completed Fab 32 structure measures 1 million sq ft -- enough space to fit 17 football fields. More than 1000 employees will operate the factory in positions such as process, automation and yield engineers and senior manufacturing technicians.
Intel said Fab 32 will be among Intel's most "environmentally friendly factories," incorporating a number of energy and water conservation measures.
For more information, visit: www.intel.com
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