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  • STMicroelectronics Orders ESI's Cignis Laser
Jul 2008
Electro Scientific Industries Inc. of Portland, Ore., a provider of photonic and laser systems for microengineering applications, announced that Switzerland-based semiconductor company STMicroelectronics has ordered its Cignis laser singulation system. ESI introduced the laser this week at the Semicon West 2008 microelectronics trade show in San Francisco. The order for the picosecond laser system is the result of an ongoing partnership between the two companies to produce a flexible, scalable laser for applications including wafer dicing, scribing and CMOS image sensor singulation, ESI said. "As the industry moves toward thinner wafers with lower k dielectrics for advanced devices, mechanical processes are reaching their limits," said Gareth Bignell, program manager, 300-mm equipment selection, STMicroelectronics. "Of the three types of wafer scribing processes available on the market, we found that mechanical saws could damage the dielectric layers, while nanosecond lasers weakened the wafer's die break strength." Bignell said ESI's experiments with picosecond lasers led to Cignis, its product for wafers thinner than 100 µm. As a result, "...we are optimistic that our collaboration will enable us to quickly and effectively transition from 65-nm to 45-nm processing to meet our product roadmaps."

Exhibiting the characteristic of materials that are electrical insulators or in which an electric field can be sustained with a minimum dispersion of power. They exhibit nonlinear properties, such as anisotropy of conductivity or polarization, or saturation phenomena.
The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
The process of perforating a silicon or ceramic substrate with a series of tiny holes along which it will break. Nd:YAG or CO2 lasers are now routinely used.
A cross-sectional slice cut from an ingot of either single-crystal, fused, polycrystalline or amorphous material that has refined surfaces either lapped or polished. Wafers are used either as substrates for electronic device manufacturing or as optics. Typically, they are made of silicon, quartz, gallium arsenide or indium phosphide.
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