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Thick-SOI Market Predicted to Increase

EuroPhotonics
Sep 2008
LYON, France -- Thick silicon-on-insulator (SOI) substrates — used in microelectromechanical systems (MEMS), in power device electronics and in the power semiconductor industry — have a bright future, according to the recently released “Thick-SOI Applications, Markets & Players 2006-2012 Report.” The report from Yole Développement predicts that the global market for thick SOI will reach $115 million in 2012, an increase of approximately 60 per cent from 2007. The industry will reach the $100 million mark in 2011, with 10 per cent compound annual growth rate forecasted until 2012.

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By 2012, the market for thick silicon-on-insulator substrates is expected to increase by nearly 60 percent. The primary applications include microelectromechanical systems and power devices.


In 2007, MEMS accounted for 38 per cent of the market, and this segment is expected to exceed 45 per cent by 2012. The increase in demand results from the production of accelerometers and gyroscopes, which are used in consumer products such as cell phones, game pads and cameras.

The use of thick SOI in power electronics, mainly integrated in plasma TV drivers, is expected to decrease, however. The previous compound annual growth rate was routinely above 25 per cent, but as a result of competition from LCD technology, the growth rate is expected to slow to about 6 per cent after 2008.

Asia supplies about 75 per cent of all thick-SOI wafers and consumes between 40 and 50 per cent of the global wafer volume. In 2007, European companies gained approximately 22 per cent of the total thick-SOI revenues, with the US earning only about 4 percent.


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