3M, EV Group Settle Patent Infringement Suit
3M of St. Paul, Minn., a product research and development company, and EV Group of St. Florian, Austria, a wafer-processing solutions provider, have agreed to settle patent infringement litigation related to temporary wafer bonding brought by the latter against the former in US District Court. Under terms of the settlement, the Minnesota company, its customers and licensed suppliers of its wafer support system will continue to make, sell and use the system in global semiconductor and packaging markets. The Austrian company will continue to defend and protect its patent portfolio and intellectual property.
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