Sunnyvale, Calif.-based Bridgelux Inc., an LED technology supplier, has been awarded a US patent for its surface-mountable chip design. By eliminating the need for traditional LED packaging, this architecture is anticipated to change how the devices will be deployed. The design will offer high flux density with an ultrasmall footprint and thin profile as well as the ability to closely pack multiple chips in space-limited applications, including camera flash, LCD display backlighting, and general or specialty lighting.