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  • 3M, Suss Team for Wafer Bonding
Jun 2009
3M, supplier of advanced materials to the semiconductor industry, and Suss MicroTec, a maker of semiconductor processing equipment, announced an agreement to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer bonding of ultrathin wafers required for 3-D packaging. As part of this nonexclusive agreement, Suss MicroTec becomes an authorized equipment supplier for the 3M WSS and will manufacture and sell XBC300 and CBC300 wafer bonders configured to use 3M’s WSS materials including 3M Liquid UV-curable adhesive and light-to-heat conversion coating.

The technology of generating and harnessing light and other forms of radiant energy whose quantum unit is the photon. The science includes light emission, transmission, deflection, amplification and detection by optical components and instruments, lasers and other light sources, fiber optics, electro-optical instrumentation, related hardware and electronics, and sophisticated systems. The range of applications of photonics extends from energy generation to detection to communications and...
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