Luminus Introduces its First UV PhlatLight LED
BILLERICA, Mass., April 5, 2010 — Big-chip PhlatLight LED developer Luminus Devices Inc., announced the UV CBT-120, its first big-chip ultraviolet LED built on PhlatLight technology.
Suitable for UV applications that demand a high flux of UV photons, the solid-state lighting solution delivers a power density of 1 W/mm2, offering extremely high optical output of 10 W at 390 nm.
The device features high thermal-conductivity packaging, with a junction to heat sink thermal resistance of 0.7 °C/W so it can reliably be driven to power levels necessary for industrial processing.
Additionally, it is suitable for industrial processes, including epoxy, ink, paint, laminate and adhesive curing, and semiconductor processing.
For more information, visit: www.luminus.com
- Common name for a variety of adhesives used for lens bonding, fiber optic splicing and other photonics applications. The term is actually a prefix denoting the presence of an epoxide group in a molecule.
- heat sink
- A series of flanges or other conducting surfaces, usually metal, attached to an electronic device to transmit and dissipate heat that might damage internal circuitry.
- thermal resistance
- In a laser, a measure of the device's ability to dissipate internally generated heat.
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