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CEA-Leti, Shinko Sign Semiconductor Packaging Agreement

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GRENOBLE, France, Jan. 31, 2011 — To provide increased performance and smaller sized portable electronics and other advanced systems, CEA-Leti signed a multiyear agreement with Shinko Electric Industries Co. Ltd. to develop advanced semiconductor packaging technology. The work will focus on silicon interposers, a technology that offers advantages for next-generation applications. The passive intermediate layers can be used in several ways to boost the useable performance and reduce the footprint of advanced silicon chips. Example applications include the mounting of multiple chips on a single interposer, and the...Read full article

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    Published: January 2011
    3-D silicon packagingBusinessCEA-LetidefenseEuropeFranceGrenobleJapanpassive intermediate layersShinko Electric Industries Co. Ltd. semiconductor packagingsilicon chipssilicon diessilicon interposerssingle interposer

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