Femtosecond fiber laser manufacturer Imra America Inc. of Ann Arbor, Mich., a subsidiary of Aisin Seiki Co. Ltd. of Kariya, and Disco Corp. of Tokyo have teamed to develop lasers and processing systems for dicing of semiconductor materials. The companies will provide solutions that use the capabilities of femtosecond lasers, which feature minimal thermal effects in materials processing. Imra is the exclusive licensee of US Patent No. 5,656,186 by the University of Michigan, essential for femtosecond and picosecond laser materials processing, which it licenses to its customers. Disco manufactures precision cutting, grinding and polishing machines.