SANTA CLARA, Calif., Sept. 26, 2012 — Diamond products and deposition equipment supplier sp3 Diamond Technologies Inc. has received two patents for technology that makes semiconductor and laser packaging more reliable.
The US Patent and Trademark Office awarded sp3 two patents for its DiaMatch coefficient of thermal expansion (CTE) matched heat spreader technology. The patents cover a diamond-based multilayered structure and the methods used to create the layers. The technology is suited for mounting large semiconductor chips such as high-power transistors and laser diodes that require CTE matching.
“In 2007, we received Phase II SBIR [Small Business Innovation Research] funding from the Missile Defense Agency to develop a thermal management solution that enables the next generation of high-power lasers and semiconductors. We had established solid IP in this area and began providing solutions with great potential that target current and future high-power semiconductor and laser applications,” said Dwain Aidala, president and COO of sp3 Diamond Technologies.
The company is seeking partners to help commercialize the technology.
For more information, visit: www.sp3diamondtech.com