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SMIC Achieves Sensor Breakthrough

Photonics.com
Jan 2013
SHANGHAI, Jan. 8, 2013 — Semiconductor Manufacturing International Corp. (SMIC) has announced a breakthrough in its development of backside-illuminated CMOS image sensor (CIS) technology for mobile phone cameras, with the first test chip demonstrating good image quality even in low-light conditions.

The complete backside-illuminated (BSI) process development allows SMIC to broaden its CMOS image sensor foundry service offerings to customers with 5-megapixel and higher resolution phone cameras and high-performance video camera products. The company says that BSI sensors are more light-sensitive than frontside-illuminated CMOS sensors, allowing smartphones to take brighter, crisper images at night or indoors.

The company plans to soon begin early development of next-generation CIS technology based on 3-D integrated circuits.

The BSI technology is targeted to enter risk production with partnering customers in 2013.

For more information, visit: www.smics.com


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