PixelSensor multispectral photodiodes combine custom spectral filters with the fast linear response of photodiodes – opening new possibilities for application-specific optical sensors. These photodiodes are available for discrete, multi-element, and array devices – supporting single- or multiple wavelength-selective filters for improved sensitivity and contrast for multispectral applications from portable fluorescence detection to dedicated devices and instrumentation.

Standard PixelSensor photodiodes are available with spectral response from 350-1050nm, supporting ultraviolet (UV), visible, and near infrared (NIR) detection. Spectral band performance is customized to fit each application – selectively transmitting and blocking light across the targeted wavelength bands.

The spectral bands, performance, layout, and board design of PixelSensor photodiodes can be customized for OEM application-specific OEM requirements. In addition to delivering multispectral photodiodes, PIXELTEQ provides expert opto-electrical subassembly services for OEM device configuration and production.

Applications include:
  •  Biomedical devices & instrumentation
  •  Agriculture & food processing
  •  Authentication & taggant sensors
  •  Fluorescence & quantum dot detection
  •  Security & intrusion detection
  •  Fluid & gas sensors
  •  Industrial sensors & instrumentation
  •  Optical scanning & in-line inspection
  •  Ambient & narrow-band light sensors
  •  Remote / wireless sensors
  •  Custom multi-band devices avaialble

Custom spectral detection and enhanced performance
Choose the exact band(s) you want to see in the UV, visible, and NIR (near infrared) wavelengths. Single or multiple wavelength-selective filters applied directly to photodiodes deliver tailored response, improved sensitivity, and unmatched robustness.

Multispectral photodiodes and arrays
Use multiple narrow-band channels to deliver rich multispectral data from multi-element photodiodes and arrays.

Scalable process for volume production
Exclusive micro-patterning technology and in-house wafer-level processes scale to deliver high-precision, high-volume production devices.

Application-specific OEM devices and assembly
Collaborate with our team to get expert optical and electro-mechanical design assist and subassembly service to package your application-specific sensor.