Escatec Appoints Micro-assembly Expert to Head MOEMS Facility
HEERBRUGG, Switzerland, April 29, 2013 — Wolfgang Plank, the R&D project manager of electronics manufacturing services provider Escatec, was appointed head of the company’s MOEMS (micro-optic electronic manufacturing services) facility.
The new role takes advantage of Plank’s career-long focus on LEDs, micro-optics and micro-assembly. He has developed products for companies such as Intel and Ivoclar Vivadent, ranging from a cooling plate for electronic chips through a piezoelectric system to calibrate IR lasers for satellites, to a blue LED device for curing dental materials.
The MOEMS facility features an ISO Class 7 cleanroom with capabilities such as chip-on board (die and wire bonding), encapsulation, solder flip chip, ball grid array and micro-optics assembly. The cleanroom also has ISO Class 5 sections for ultraclean assembly.
“It is very unusual for a contract manufacturer to have invested in the expensive cleanroom facilities required for MOEMS,” Plank said. “Micro-assembly is clearly the way of the future as electronics continues to shrink, especially in, for example, implantable medical devices and LED/OLED lighting.”
For more information, visit: www.escatec.com
- An area in which airborne particulates can be monitored and controlled so that given size particles do not exceed a specified concentration, thereby eliminating potential dysfunctions in gyroscopes, ball bearings and other materials and lubricants.
- Tiny (less than 2 mm in diameter) lenses, beamsplitters and other optical components used, for example, in endoscopes or microscopes or to focus light from semiconductor lasers and optical fibers.
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