Tessera, Freescale Settle Litigation
SAN JOSE, Calif., Aug. 27, 2013 — Freescale Semiconductor Inc. and Tessera Technologies Inc. have reached a settlement in a previously pending patent infringement lawsuit against Freescale.
Electronic packaging solutions provider Tessera has agreed to dismiss its claims against Freescale, an embedded hardware producer, dissolving the asserted infringement of two US patents concerning face-up semiconductor chip assemblies (See: ITC: Tessera Patents Infringed). In exchange for being released from litigation, Freescale will make a payment of an undisclosed amount to Tessera.
“We are pleased to have settled this matter with Freescale,” said Jim MacDonald, Tessera’s executive vice president of Intellectual Property and Business Development. “We believe this settlement reflects well on the strength of our intellectual property, as well as our commitment to protecting our innovations and intellectual property.”
The full terms and conditions of the settlement have not been disclosed.
For more information, visit: www.tessera.com or www.freescale.com
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