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Tessera, Freescale Settle Litigation

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SAN JOSE, Calif., Aug. 27, 2013 — Freescale Semiconductor Inc. and Tessera Technologies Inc. have reached a settlement in a previously pending patent infringement lawsuit against Freescale. Electronic packaging solutions provider Tessera has agreed to dismiss its claims against Freescale, an embedded hardware producer, dissolving the asserted infringement of two US patents concerning face-up semiconductor chip assemblies (See: ITC: Tessera Patents Infringed). In exchange for being released from litigation, Freescale will make a payment of an undisclosed amount to Tessera. “We are pleased to have settled this...Read full article

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    Published: August 2013
    AmericasBusinessCaliforniaElectronics & Signal Analysisface-up semiconductor chip assembliesFreescaleintellectual propertyJim MacDonaldlawsuitlitigationpatent infringement actionPhotonic Component Mfg. Equip.Photonics Component Mfg. Equip.settlementTessera

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