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Excimer-Laser Metrology Improves Lithography Process Control

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Paolo Alagna, Gregory Rechtsteiner, Ivan Lalovic and Theodore Cacouris, Cymer LLC

Process- and technology-specific correlations can be established for better process control, and to prevent excursions. As Moore’s law marches on, semiconductor manufacturers rely on advances in photolithography – the use of 193-nm ArF excimer lasers, for example, coupled with optical and process techniques to improve resolution and reduce patterning variations. Recent examples of such technologies include advanced reticle designs that correct for optical proximity effects, use of double- or multiple-patterning exposure methods, computational techniques that achieve...Read full article

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    Published: October 2013
    Glossary
    lithography
    Lithography is a key process used in microfabrication and semiconductor manufacturing to create intricate patterns on the surface of substrates, typically silicon wafers. It involves the transfer of a desired pattern onto a photosensitive material called a resist, which is coated onto the substrate. The resist is then selectively exposed to light or other radiation using a mask or reticle that contains the pattern of interest. The lithography process can be broadly categorized into several...
    metrology
    Metrology is the science and practice of measurement. It encompasses the theoretical and practical aspects of measurement, including the development of measurement standards, techniques, and instruments, as well as the application of measurement principles in various fields. The primary objectives of metrology are to ensure accuracy, reliability, and consistency in measurements and to establish traceability to recognized standards. Metrology plays a crucial role in science, industry,...
    process control
    The collection and analysis of data relevant to monitoring the rate and quality of industrial production, either continuously or in batches. Corrections can be made manually or automatically, via a feedback control loop.
    AmericasCymerexcimeexcursionsFeaturesGregory RechtsteinerIMECindustrialIvan LaloviclithographymetrologyPaolo Alagnaprocess controlTest & MeasurementTheodore CacourisLasers

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