TUALATIN, Ore., Oct. 24, 2013 — LPKF Laser & Electronics has produced a higher-power laser source for its MicroLine family of UV laser circuit board depaneling systems.
The new 12-W power source is suitable for thicker materials such as 1.57-mm FR4, a composite material; the earlier 6-W model was for thinner materials such as flex or rigid-flex materials.
UV laser processing is a low-stress alternative to mechanical printed circuit board depaneling methods such as routing or dicing. Replacing a physical tool with a virtual one eliminates the effects of stress such as burring and damaged components.
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