Chip-Scale Packaging Applied to CMOS Sensor
Photobit Corp. of Pasadena, Calif., and ShellCase Ltd. of Jerusalem have implemented wafer-level chip-scale packaging for complementary metal oxide semiconductor (CMOS) digital imaging sensors. ShellCase's ShellOP process encases the imager die with glass plates and an optically clear epoxy. The package can be assembled to a PC board with standard surface-mount technology.
Nick Doudoumopoulos, president of Photobit, said that qualification of the sensors was progressing satisfactorily and that his company's PB-100 and PB-300 chips are candidates to receive the technology. The optoelectronic devices are expected to have applications in cell phone videoconferencing and other low-cost mobile imaging systems.
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