ASML to Provide EUV Lithography Systems to US Semiconductor Manufacturer
VELDHOVEN, the Netherlands, April 23, 2015 — ASML Holding NV will provide at least 15 extreme ultraviolet (EUV) lithography systems under a new agreement with a U.S. semiconductor manufacturer. Financial terms were not disclosed.
Delivery of the first two NXE:3350B EUV systems is expected before the end of 2015. The customer, which already uses some EUV systems, intends to use the new machinery for multiple processing steps in future process technology nodes.
EUV lithography simplifies the manufacturing process of the most advanced microchips, significantly improving yield and cycle time, according to ASML.
"EUV is now approaching volume introduction," said ASML President and CEO Peter Wennink. "Long-term EUV planning and EUV ecosystem preparation [are] greatly supported by this commitment to EUV, kick-starting a new round of innovation in the semiconductor industry. The commitment extends the planning horizon and increases the confidence in EUV."
For more information, visit www.asml.com.
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