SAN JOSE, Calif., Feb. 17, 2016 — Ultratech Inc., a supplier of lithography, laser-processing and inspection systems, said it has received a multiple-system order from a leading outsourced semiconductor assembly and test company. Financial terms of the purchase order were not disclosed. Ultratech’s AP300E lithography system will be used for various advanced packaging applications including copper pillar, wafer-level packaging (WLP) and emerging technologies such as fan-out WLP and silicon interposers to support growth driven by mobile devices. ”Recently, a number of companies have been investigating reduction steppers for use in advanced packaging applications,” said Rezwan Lateef, general manager and vice president of Ultratech. “Specifically, our system provided a larger depth-of-focus and nearly perfect vertical sidewall angles for copper pillar applications, and demonstrated superior extendibility for next-generation, fine-pitch, fan-out WLP applications.” The AP300 family of lithography systems is built on Ultratech's customizable Unity Platform, delivering superior overlay, resolution and side wall profile performance, and enabling highly-automated and cost-effective manufacturing. These systems are suited for copper pillar, fan-out, through-silicon via and silicon interposer applications. In addition, the platform has numerous application-specific product features to enable next-generation packaging techniques. Ultratech’s systems are used to manufacture semiconductor devices, high-brightness LEDs and atomic layer deposition systems.