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Heptagon Expands, Reaches Shipment and Miniaturization Milestones

Photonics.com
Mar 2016
LOOP, Singapore, March 2, 2016 — Heptagon Micro Optics Pte. Ltd. has announced a shipment milestone of over 2 billion systems, the opening of two new facilities and the development of what they said is the world’s smallest wafer sensing module.

"We are well positioned to pursue new market opportunities with the expansion of our fab in Woodlands, Singapore, and the opening of our new factory in Ang Mo Kio, Singapore," says S.C. Leong, Heptagon’s chief operating officer.
Heptagon's new module is 4 times thinner than a U.S. penny.
Heptagon's new module is 4 times thinner than a U.S. penny. Courtesy of Business Wire.
The new factory expands the company’s shipment capacity to 1 billion units per year. In addition to the new Singapore location, Heptagon has expanded its sales, marketing and engineering presence in Silicon Valley as a result of strong customer interest in products and miniaturization, integration, optics and electrical design.

Heptagon’s Silicon Valley Labs and Executive Briefing Center showcase the latest interface and sensing technologies while providing convenient access for the innovators and decision makers in Silicon Valley. It recently introduced the industry’s first multipoint 3D ranging sensor for mobile application. Its proprietary technologies, like adaptive stereo, enable indoor and outdoor imaging in a single solution while creating a unique platform for 3D capturing. Adaptive illumination technology allows interference-free, multi-user applications for collaborative augmented reality, automotive cockpits and digital signage.

Heptagon also recently developed what is said is the world’s smallest near-field optical sensing modules based on wafer-level miniaturization technology. The sensor has a thickness of 350 µm and a 2-mm2 surface area that includes a built-in illuminator, light sensor, electronics, crosstalk prevention features and a lens system. The company cited this development as the foundation for highly miniaturized system-in-a-package sensors in rapidly evolving for mobile and wearable device markets.

“By combining proprietary design and processes in solution development for these significantly thinner sensors, we’re enabling greater design flexibility with reduced form factor and improved aesthetics for mobile and wearable devices seeking slimmer profiles, such as smart watches," said Hartmut Rudmann, senior vice president of engineering at Heptagon. "It is now possible to spread out more sensors in a device to increase coverage or for a more accurate reading.”

Heptagon develops 3D imaging, sensing and illumination technology for the Internet of Things (IoT) and smart devices.



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