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To Manufacture More, Automate

Photonics Spectra
Jun 2000
Automating the entire process of assembling, packaging and testing optoelectronic devices improves throughput as well as yield. Too much handling can spoil the product.

Kamran S. Mobarhan and Randy Heyler

The rapid expansion of dense wavelength division multiplexing telecommunications networks has created a worldwide demand for optoelectronic devices that is becoming increasingly more difficult to meet. This stems primarily from the limitations related to production capacity and from package design issues that hinder high-volume production.

Proper package design and automation are very important in high-volume production of fiber optic components for telecommunications. Standardizing package configurations and designs would simplify automated manufacturing processes. Until this occurs, however, a palletized tooling approach improves throughput, cycle time and yield, offering an immediate solution to the pressing problem of production capacity and to yield issues that stem largely from excessive direct handling of components. . . .


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