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ESI Licenses Laser Drilling Patent from Sandia

Photonics.com
Dec 2000
PORTLAND, Ore., Dec. 7 -- Electro Scientific Industries Inc., supplier of production equipment to the electronics market, has obtained an exclusive three-year license agreement with Sandia National Laboratories for patented beam shaping technology. The technology, used on the Model 5310 Laser Microvia Drill, is targeted at advanced packaging drilling applications down to 25 µm. This imaging and beam shaping technology allows ESI to deliver 25 percent higher throughput by efficient delivery of the laser energy to the work surface, the company said.
ESI continues to invest in strategic technology that allows us to improve our leadership position in the advanced via drilling market, said Tom Richardson, general manager for ESI's advanced packaging products. In addition to the license of this patent, we are pursuing collaborative technology developments with Sandia Labs to further enhance the way laser energy is delivered to the work surface, and we look forward to these future innovations.


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