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New High Temperature Resistant Epoxy Adhesive, Sealant & Encapsulant Available From Master Bond Inc.

Photonics.com
Jul 2001
   A new high temperature resistant, room temperature curing epoxy adhesive, sealant and encapsulant is now available from Master Bond Inc. This two-component system called EP21HT has a noncritical one to one mix ratio, weight or volume. It has a service operating temperature range of -60 to 400 °F. EP21HT produces durable, high strength, exceptionally tough bonds to both similar and dissimilar substrates. Adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics is excellent. Bonds are also resistant to thermal cycling and many chemicals including water, oil, fuels and most organic solvents even upon prolonged exposure at elevated temperatures. It is also serviceable as a high performance encapsulant with excellent electrical insulation properties.

Master Bond EP21HT is easily mixed and flows evenly and smoothly. A nondrip version with similar properties called EP21HTND also available. It is 100% reactive and does not contain any solvents or diluents. Tensile shear strengths as high as 3000 psi are obtained after room temperature cure and the bonds retain high strength properties when exposed to the 300 - 350 °F range. EP21HT is available in pint, quart, gallon, 5 gallon, and 55 gallon kits.



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