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Mitsubishi Electric Develops Laser Technology

TOYKO, Feb. 21, 2014 — Mitsubishi Electric Corp. is set to unveil laser technology that ultimately will improve the performance of electronic devices.

Mitsubishi Electric has developed new laser micro glass processing technology. Courtesy of Mitsubishi Electric Corp.

The company has developed a micro glass processing technology that uses a pulsed far-IR CO2 laser to drill the world's smallest holes — measuring just 25 µm in diameter — in a glass substrate, enhancing its use for circuit substrates.  

To develop the technology, a CO2 laser with a wavelength of about 10 µm was used to drill transparent glass; the short microsecond laser pulses minimize the heat produced. Surface treatment technology was applied to suppress the overenlargement of drilled holes.

About 200 holes per second can be drilled using a high-precision, high-speed galvo mirror to scan the laser beam. CO2 lasers, which can easily be geared to high power, are widely used in the industry. Compared with conventional UV laser oscillators, which typically are characterized by limited light-harvesting properties, they offer improved productivity.

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