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53 products
Photonics Products
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polishing x
HASTILITE MOV 850
Universal Photonics Inc.
Type:
Polishing Material and Pads
Density (g/mL):
1.4 - 1.6
Particle Size D50 (μm):
0.3 - 0.5
Particle Size D99 (μm):
< 2
Premier Product
APS 3D: Advanced Polishing System 3D
SCHNEIDER Optical Machines Inc.
Type:
Polishing
Alumina Polishing Compounds
Meller Optics Inc.
Type:
Abrasives
Deagglomerated Grade:
Microlux-RZ
Regular Grade:
Microlux-R
CP PITCH for Continuous Polishing
Universal Photonics Inc.
Type:
Polishing Pitch
CP55 Softening Point (°C):
52 - 55
CP64 Softening Point (°C):
68 - 72
CP73 Softening Point (°C):
77 - 80
Gugolz Polishing Pitch
Meller Optics Inc.
Type:
Polishing Pitch
Burn Point:
278° to 252°
Flash Point:
246° to 213°
Melting Point:
72°C to 87°C
S3 Super Smooth Surfactant
Universal Photonics Inc.
Type:
Additives
Appearance:
Pale Blue Liquid
pH:
6.0 - 7.5
Size Availability:
1pt, 1gl, 5gl
Submerged Polisher
Universal Photonics Inc.
Type:
Polishing
Width:
1.2m
Height:
1.6m
Length:
1.2m
Compressed Air:
No
Control Panel:
PLC Touch-Screen
Customizable:
Yes
ProACT Software Suite
Satisloh GmbH
Type:
Other
SPS-50
Satisloh GmbH
Type:
Polishing
Diameter / Dimension:
5 - 50mm
Width:
700mm
Height:
1950mm
Length:
1350mm
SPS-30
Satisloh GmbH
Type:
Polishing
Diameter / Dimension:
1 - 30mm
Width:
700mm
Height:
1725mm
Length:
1300mm
SPS-200
Satisloh GmbH
Type:
Polishing
Diameter / Dimension:
5 - 300mm
Width:
1200mm
Height:
1970mm
Length:
1850mm
SPS-125
Satisloh GmbH
Type:
Polishing
Diameter / Dimension:
10 - 125mm
Width:
1000mm
Height:
2100mm
Length:
1600mm
SPS-10
Satisloh GmbH
Type:
Polishing
Diameter / Dimension:
1 - 10mm
Width:
700mm
Height:
1950mm
Length:
1350mm
GI-AP
Satisloh GmbH
Type:
Polishing
Diameter / Dimension:
0 - 500mm
Width:
1670mm
Height:
2530mm
Length:
2660mm
UNICER 1000 Cerium Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
Appearance:
Off White, Powder
Cerium Oxide Content (%):
≥ 58
Particle Size D50 (μm):
0.8 - 2.0
SC-955 PAD
Universal Photonics Inc.
Type:
Polishing Material and Pads
Density (g/cm3):
0.30 - 0.42
PSA Backing:
Yes
Removal Rate (µm/min):
0.68
HASTILITE Poly Silicon Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
Particle Size D50 (µm):
0.110 - 0.140
Particle Size D99 (µm):
< 0.389
pH:
1 - 3
HASTILITE Nano Silicon Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
% Solids:
15 - 20
Particle Size D50 (μm):
0.110 - 0.140
Particle Size D99 (μm):
< 0.389
HASTILITE Ceria-Base Polish
Universal Photonics Inc.
Type:
Polishing Material and Pads
Particle Count D50 (μm):
0.4 - 0.7
pH:
6 - 7
PO Density (g/mL):
1.50 - 1.68
ALP 120 Aspherical Lens Polisher
SCHNEIDER Optical Machines Inc.
Type:
Polishing
Diameter / Dimension:
5 - 120mm
Width:
1220mm
Height:
1948mm
Length:
1281mm
Volts:
400
Amps:
30
AR Coated ZnS Domes
HHV Advanced Technologies Pvt. Ltd., Thin Films & Optics Div.
Type:
Domes
Diameter / Dimension:
20 - 200mm
Centering Error:
TIR - 0.005 mm (<30 arcsec)
Diameter:
up to 200 mm
Radius:
±R20 to R∞
Aspheric Lenses
Avantier Inc.
Type:
Lenses
Diameter / Dimension:
1 - 1000mm
Lens Category:
Aspherical Lens
Asphere Figure Error(P-V):
3μm – smaller than 0.06μm
Centering (Beam Deviation:
3 arcmin – 0.5 arcmin
Diameter Tolerance:
+0/-0.100mm – +0/-0.010mm
Domes
Vertex Optics Inc.
Type:
Domes
Diameter / Dimension:
10 - 350mm
EVERFLO Surfacing Additive
Universal Photonics Inc.
Type:
Additives
Density (g/mL):
0.95 - 1.00
Freezing Point (°F):
26 - 28
pH:
6.4 - 8.6
CO2 Laser Optics
Rocky Mountain Instrument Co. (RMI)
Type:
Lenses
Optical Cleaning Kit
Meller Optics Inc.
Type:
Other
Morpheus™ Data Reduction Software
AOM - Arizona Optical Metrology
Type:
Data Acquisition and Analysis
Super-polished Substrates/Mirrors
Hangzhou Shalom EO
Type:
Mirrors
Diameter / Dimension:
3 - 300mm
PV:
<0.1 λ @ 633 nm
rms:
<0.02 λ @ 633 nm
Roughness:
<0.1 nm
Custom Lenses
Inrad Optics Inc.
Type:
Lenses
Diameter / Dimension:
10 - 100mm
Lens Category:
Spherical Lens
Domaille APM-HDC-5400 Programmable Polishing Machine
Fiber Optic Center Inc.
Type:
Other
NOVA Automated & Multi-Configurable Polishing System
KrellTech
Type:
Other
PR-1 Polishing Machine
P.R. Hoffman Machine Products Inc.
Type:
Polishing
Width:
117cm
Height:
127cm
Length:
66cm
Volts:
208 - 230
Amps:
20
SPM-50
Satisloh North America Inc.
Type:
Grinding
Diameter / Dimension:
0 - 50mm
Width:
700mm
Height:
1950mm
Length:
1350mm
SPS-200
Satisloh North America Inc.
Type:
Polishing
Diameter / Dimension:
5 - 200mm
Width:
1200mm
Height:
1970mm
Length:
1850mm
SPS-50
Satisloh North America Inc.
Type:
Polishing
Diameter / Dimension:
5 - 50mm
Width:
700mm
Height:
1950mm
Length:
1350mm
SPM-200
Satisloh North America Inc.
Type:
Grinding
Diameter / Dimension:
10 - 300mm
Width:
1200mm
Height:
1970cm
Length:
1850cm
Crystals for X-Ray Spectrometry
Luxium Solutions
Type:
Crystals
Curved Plates:
on tailor-made holders
Flat Plates:
unmounted or mounted
LEYBOLD OPTICS IBF series
Buhler Inc., Business Area Leybold Optics
Type:
Other
Sapphire Optics Windows
IRD Glass
Type:
Windows
Hardness:
Ra < 10Å, < 1/4λ flat
Thickness:
200 to 0.3 mm
Transmission Bandwidth:
150 to 5500 nm
Focal- πShaper
AdlOptica GmbH
Type:
Other
Alignment:
Built-in
Input Beam:
TEM00 (Single Mode)
Output Beam:
Airy Disk
PRO 80 UFF
OptiPro Systems
Type:
Polishing
Diameter / Dimension:
10 - 80mm
Width:
1000mm
Height:
2440mm
Length:
1500mm
Volts:
480
Amps:
21
Asphere Fabrication:
Standard
Tool Probing:
Standard
Work Spindle Speed:
0 - 1500 rpm
PRO 80P
OptiPro Systems
Type:
Polishing
Diameter / Dimension:
80mm
Width:
1000cm
Height:
2440cm
Length:
1500cm
Volts:
480
Amps:
24
Tool Spindle Speed:
50 - 1,500 rpm
Weight:
3,500 lbs
Work Spindle Speed:
1 - 1,500 rpm
MCP 251 CNC
OptoTech Optikmaschinen GmbH
Type:
Polishing
Diameter / Dimension:
20 - 300mm
Width:
205cm
Height:
265cm
Length:
265cm
ACP-24/96
Nanometer Technologies Inc.
Type:
Other
Cila 2.0
Clarus Engineering Corp.
Type:
Polishing
TJX438 Ceria Slurry
Demeter Technologies Inc.
Type:
Polishing Material and Pads
Concentration:
30%
D50 (µm):
0.5 - 0.7
D97:
<4.0
TPJ825 Ceria Powder
Demeter Technologies Inc.
Type:
Polishing Material and Pads
CeO2/TREO:
>60%
Concentration:
100%
D50 (µm):
1.2 - 1.6
TJP621 Ceria Powder
Demeter Technologies Inc.
Type:
Polishing Material and Pads
CeO2:
65-72 %
Concentration:
100%
D50 (µm):
1.8 - 2.2
DZr-P Zirconia Slurry
Demeter Technologies Inc.
Type:
Polishing Material and Pads
Color:
Pink
Concentration:
25%
D50 (µm):
1.4 - 1.6
D605S Ceria Slurry
Demeter Technologies Inc.
Type:
Polishing Material and Pads
Concentration:
50%
D50 (µm):
0.8 - 1.0
D97:
5.0
1
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Photonics Products
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