- Model: Fineplacer Lambda 2 Die Bonder
- Company: FINETECH GmbH & Co. KG
- Type: Equipment
- Placement accuracy: submicron
- Guidance: software supported
This table top flip chip bonder can be easily configured for a wide range of applications for process development or prototyping.
Boxberger Str. 14
12681 Berlin
Germany
Phone: +49 3093 66810