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Berliner Glas KGaA Herbert Kubatz GmbH & Co.
5/16/2014More News & Features >>
- Super-flat wafer chucks – Poster Session by Berliner Glas at the SPIE Advanced Lithography 2014
The trend of the semiconductor industry to always achieve higher integration densities as well as shrinking structural sizes also places high demands on the characteristics of the chucks that hold the wafers during the lithography and inspection processes.
Berliner Glas is a premium supplier of high-precision, custom designed wafer chucks to the semiconductor industry and knows the possibilities how to produce an ideally flat wafer chuck. Besides thermal performance and thermal management, roughness of the surface, choice of materials as well as the contact area between wafer and wafer chuck are the key parameters in influencing the wafer chucks effective flatness. Usually this contact area is decreased as much as possible to lower particle sensitivity. This can be realized by a pin structure on the chuck surface.
In its Poster Presentation during the Poster Reception of the SPIE Advanced Lithography in San Jose, California, the Berliner Glas Group will address methods of designing and evaluating such a pin structure. The Poster Session will take place on 25 February 2014 from 06:00 until 08:00 pm in Conv. Ctr. Hall 2. The abstract of Berliner Glas’ Poster Presentation can be seen here: http://www.berlinerglas.de/en/news/trade_shows_events
The Berliner Glas Group will also participate in the SPIE Advanced Lithography as an exhibitor and will inform about the broad spectrum of its solutions at its booth (No. 230). The exhibition will open on 25 and 26 February 2014.
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