FINETECH GMBH & CO. KG
Boxberger Str. 14
High accuracy bonders for photonics packaging and die attach. Bonding of laser bars and diodes, VCSELs, MEMs, sensors, flip chips, copper pillar, etc. Submicron placement accuracy with a single platform that handles thermocompression, thermosonic, eutectic, epoxy, ACF and indium bonding. Process flexibility suitable for R&D through production.
Ownership type: Privately Owned
FINETECH GMBH & CO. KG PRODUCT AND SERVICE CATEGORIES
MS=Manufacture Stock | MC=Manufacture Custom | S=Supply/Distribute | D=Design