Wafers

AS9100/ISO 9001 manufacturer of substrates, wafers, flat optics, precision shims/spacers, 0.127-mm sq to 450-mm diameter. Precision lapping, polishing, dicing, 5-axis CNC machining, small diameter core drilling, hole drilling. Ultrathin 10-20 microns, ultraflat, tight tolerances. Fused silica, glass, sapphire, ceramics, metals. Large inventory.

Precision optical glass: strip, blanks, pressings, polished balls, near-UV transmitting i-Line glass, ceramic substrates, CaF2, UV/IR materials, quartz, fused silica (standard/excimer grade), Nanoceram. Ohara CCZ ultralow expansion (excellent CTE uniformity, blank form, to 1.8 m diam). Double-side polished substrates (low surface roughness, excellent flatness).

Manufactures precision optical glasses: strip/slab, blanks, fine gobs, polished ball lenses, near-UV transmitting i-Line glass, ceramic substrates, CaF2, UV/IR materials, quartz, fused silica (std./excimer grade). Ohara CCZ ultralow expansion (excellent CTE; large size). Nanoceram. Double-side polished substrates (low surface roughness, excellent flatness).

Teledyne DALSA is a part of Teledyne's Vision Solutions group and a leader in the design, manufacture, and deployment of digital imaging components for machine vision. Teledyne DALSA image sensors, cameras, smart cameras, frame grabbers, software, and vision solutions are at the heart of thousands of inspection systems around the world.